Global Multi-chip Package GaN Power ICs market size is predicted to grow from US$ 790 million in 2025 to US$ 1516 million in 2032; it is expected to grow at a CAGR of 10.0% from 2026 to 2032.

Global Multi-chip Package GaN Power ICs Market Growth and Outlook | CAGR of 10%

The global Multi-chip Package GaN Power ICs market size is predicted to grow from US$ 790 million in 2025 to US$ 1516 million in 2032; it is expected to grow at a CAGR of 10.0% from 2026 to 2032. Multi-chip Package (MCP) GaN Power ICs are a type of power integrated circuit that combines multiple semiconductor components into a single package using Gallium Nitride (GaN) technology. GaN is a high-performance material that offers several advantages over traditional silicon, especially for power electronics, thanks to its high electron mobility, high breakdown voltage, and efficient thermal management. United States market for Multi-chip Package GaN Power ICs is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032. China market for Multi-chip Package GaN Power ICs is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032. Europe market for Multi-chip Package GaN Power ICs is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032. Global key Multi-chip Package GaN Power ICs players cover Infineon Technologies, STMicroelectronics, Texas Instruments, PI, Innoscience, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2025. Infinity Market Research newest research report, the Multi-chip Package GaN Power ICs Industry Forecast looks at past sales and reviews total world Multi-chip Package GaN Power ICs sales in 2025, providing a comprehensive analysis by region and market sector of projected Multi-chip Package GaN Power ICs sales for 2026 through 2032. With Multi-chip Package GaN Power ICs sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Multi-chip Package GaN Power ICs industry. This Insight Report provides a comprehensive analysis of the global Multi-chip Package GaN Power ICs landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Multi-chip Package GaN Power ICs portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms unique position in an accelerating global Multi-chip Package GaN Power ICs market. This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Multi-chip Package GaN Power ICs and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Multi-chip Package GaN Power ICs. This report presents a comprehensive overview, market shares, and growth opportunities of Multi-chip Package GaN Power ICs market by product type, application, key manufacturers and key regions and countries. Segmentation by Type: &nbsp;&nbsp;&nbsp; Controller+Driver+GaN &nbsp;&nbsp;&nbsp; Driver+GaN &nbsp;&nbsp;&nbsp; Driver+2*GaN &nbsp;&nbsp;&nbsp; Driver+Protection+GaN Segmentation by Application: &nbsp;&nbsp;&nbsp; Electronic Equipment &nbsp;&nbsp;&nbsp; Communication Equipment &nbsp;&nbsp;&nbsp; Electronic Vehicle Charger &nbsp;&nbsp;&nbsp; Industrial Power Supply &nbsp;&nbsp;&nbsp; Others This report also splits the market by region: &nbsp;&nbsp;&nbsp; Americas &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; United States &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; Canada &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; Mexico &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; Brazil &nbsp;&nbsp;&nbsp; APAC &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; China &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; Japan &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; Korea &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; Southeast Asia &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; India &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; Australia &nbsp;&nbsp;&nbsp; Europe &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; Germany &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; France &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; UK &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; Italy &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; Russia &nbsp;&nbsp;&nbsp; Middle East & Africa &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; Egypt &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; South Africa &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; Israel &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; Turkey &nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp;&nbsp; GCC Countries The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the companys coverage, product portfolio, its market penetration. &nbsp;&nbsp;&nbsp; Infineon Technologies &nbsp;&nbsp;&nbsp; STMicroelectronics &nbsp;&nbsp;&nbsp; Texas Instruments &nbsp;&nbsp;&nbsp; PI &nbsp;&nbsp;&nbsp; Innoscience &nbsp;&nbsp;&nbsp; Transphorm &nbsp;&nbsp;&nbsp; Elevation &nbsp;&nbsp;&nbsp; JOINT POWER EXPONENT &nbsp;&nbsp;&nbsp; Southchip Semiconductor Technology &nbsp;&nbsp;&nbsp; DONGKE &nbsp;&nbsp;&nbsp; HYSIC &nbsp;&nbsp;&nbsp; Kiwi Instruments &nbsp;&nbsp;&nbsp; SPMICRO &nbsp;&nbsp;&nbsp; Chipown &nbsp;&nbsp;&nbsp; Wuxi SI-POWER MICRO-ELECTRONICS &nbsp;&nbsp;&nbsp; Shenzhen Chengxin Micro Technology &nbsp;&nbsp;&nbsp; Lii Semiconductor &nbsp;&nbsp;&nbsp; Shenzhen Chuangxin Weiwei Electronics &nbsp;&nbsp;&nbsp; REACTOR &nbsp;&nbsp;&nbsp; Leadtrend &nbsp;&nbsp;&nbsp; CPS &nbsp;&nbsp;&nbsp; MIX-DESIGN SEMICONDUCTOR Technology &nbsp;&nbsp;&nbsp; Meraki &nbsp;&nbsp;&nbsp; JoulWatt Technology &nbsp;&nbsp;&nbsp; ETA Semiconductor &nbsp;&nbsp;&nbsp; Weipu Photoelectrical Technology Key Questions Addressed in this Report What is the 10-year outlook for the global Multi-chip Package GaN Power ICs market? What factors are driving Multi-chip Package GaN Power ICs market growth, globally and by region? Which technologies are poised for the fastest growth by market and region? How do Multi-chip Package GaN Power ICs market opportunities vary by end market size? How does Multi-chip Package GaN Power ICs break out by Type, by Application?

Report	Global Multi-chip Package GaN Power ICs Market Trends, Growth and Outlook 2026-2032
Selected License	Multi ID: ILR3272

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