The global Equipment for Cutting, Grinding, and Polishing Hard and Brittle Materials market size is predicted to grow from US$ 641 million in 2025 to US$ 1012 million in 2032; it is expected to grow at a CAGR of 7.1% from 2026 to 2032.

Equipment for cutting, grinding, and polishing hard and brittle materials is a precision tool specifically designed for processing high-hardness, low-toughness materials such as ceramics, sapphire, silicon carbide, optical glass, and single-crystal silicon. It typically includes multi-wire cutting machines, precision grinding machines, polishing machines, and laser processing equipment. The average price of this product is approximately US$430,000 per unit, with global sales of approximately 1,523 units. The upstream of hard and brittle material processing equipment relies on key consumables and core components such as diamond wire (0.08?0.12 mm diameter), PCD/CBN cutting tools (hardness HV8,000), and ultrafast lasers. The midstream focuses on equipment manufacturing and system integration, emphasizing processing accuracy (5 ?m) and surface roughness control (Ra0.05 ?m). Downstream applications cover industries such as photovoltaics, semiconductors, consumer electronics, automotive, and aerospace. Future development trends include intelligent control, green processes, combined laser and mechanical processing, and the widespread adoption of automated production lines, thereby significantly improving efficiency and reducing overall costs.

United States market for Equipment for Cutting, Grinding, and Polishing Hard and Brittle Materials is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032.

China market for Equipment for Cutting, Grinding, and Polishing Hard and Brittle Materials is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032.

Europe market for Equipment for Cutting, Grinding, and Polishing Hard and Brittle Materials is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032.

Global key Equipment for Cutting, Grinding, and Polishing Hard and Brittle Materials players cover Applied Materials, Lam Research, DISCO Corporation, PSS, Okamoto, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2025.

Infinity Market Research newest research report, the ?Equipment for Cutting, Grinding, and Polishing Hard and Brittle Materials Industry Forecast? looks at past sales and reviews total world Equipment for Cutting, Grinding, and Polishing Hard and Brittle Materials sales in 2025, providing a comprehensive analysis by region and market sector of projected Equipment for Cutting, Grinding, and Polishing Hard and Brittle Materials sales for 2026 through 2032. With Equipment for Cutting, Grinding, and Polishing Hard and Brittle Materials sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Equipment for Cutting, Grinding, and Polishing Hard and Brittle Materials industry.

This Insight Report provides a comprehensive analysis of the global Equipment for Cutting, Grinding, and Polishing Hard and Brittle Materials landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Equipment for Cutting, Grinding, and Polishing Hard and Brittle Materials portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms? unique position in an accelerating global Equipment for Cutting, Grinding, and Polishing Hard and Brittle Materials market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Equipment for Cutting, Grinding, and Polishing Hard and Brittle Materials and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Equipment for Cutting, Grinding, and Polishing Hard and Brittle Materials.

This report presents a comprehensive overview, market shares, and growth opportunities of Equipment for Cutting, Grinding, and Polishing Hard and Brittle Materials market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:

    Cutting Equipment (Multi-wire Saw)
    Grinding Equipment
    Polishing Equipment
    Other
    Segmentation by Material Compatibility:
    Ceramics
    Sapphire
    Silicon Carbide
    Quartz Glass
    Other
    Segmentation by Precision:
    Standard Grade (Ra0.8 ?m)
    High Precision Grade (Ra0.05 ?m)

Segmentation by Application:

    Photovoltaic Industry
    Consumer Electronics
    Semiconductors
    Other

This report also splits the market by region:

    Americas
        United States
        Canada
        Mexico
        Brazil
    APAC
        China
        Japan
        Korea
        Southeast Asia
        India
        Australia
    Europe
        Germany
        France
        UK
        Italy
        Russia
    Middle East & Africa
        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the companys coverage, product portfolio, its market penetration.

    Applied Materials
    Lam Research
    DISCO Corporation
    PSS
    Okamoto
    Nagase Integrex
    JTEKT
    Hans Laser
    Hunan Yujin Machinery
    DINOSAW
    Chevaliertw
    Beijing Jingdiao Group
    HGLASER
    J-TECH CNC Technology
    Qingdao Gaoce Technology

Key Questions Addressed in this Report

What is the 10-year outlook for the global Equipment for Cutting, Grinding, and Polishing Hard and Brittle Materials market?
What factors are driving Equipment for Cutting, Grinding, and Polishing Hard and Brittle Materials market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Equipment for Cutting, Grinding, and Polishing Hard and Brittle Materials market opportunities vary by end market size?
How does Equipment for Cutting, Grinding, and Polishing Hard and Brittle Materials break out by Type, by Application?