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Global Heat Sink Module Market Size, Share and Analysis Report 2026-2032
Feb 2026
Semiconductor and Electronics
Pages: 149
ILR4341
The global Heat Sink Module market size is predicted to grow from US$ 8315 million in 2025 to US$ 13408 million in 2032; it is expected to grow at a CAGR of 7.3% from 2026 to 2032.
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A Heat Sink Module is an integrated thermal management assembly that combines a heat sink with heat pipes, vapor chambers, fans, and mechanical interfaces to efficiently dissipate heat from electronic devices within constrained spaces. A typical module consists of a base plate in direct contact with the heat source, thermal enhancement components such as heat pipes or vapor chambers, fin or pin arrays, and mounting or interface structures. Common materials include aluminum alloys, copper, and aluminum?copper composites. By technology, heat sink modules are generally categorized into passive modules, active air-cooled modules, and hybrid heat pipe or vapor chamber modules. They are widely used in servers and data center equipment, notebook computers, telecommunications infrastructure, power semiconductor modules, electric vehicles, renewable energy systems, and industrial electronics, serving as a critical enabler of system-level thermal control and high-reliability operation.
In 2025, global Heat Sink Module shipments reached approximately 350?550 million units, spanning consumer electronics, IT hardware, and industrial and new energy applications. Typical FOB prices ranged from USD 8 to USD 45 per module, with notebook and telecom modules positioned at the lower to mid range, while high-performance modules for servers, AI accelerators, and electric vehicles commanded significantly higher prices.
United States market for Heat Sink Module is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032.
China market for Heat Sink Module is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032.
Europe market for Heat Sink Module is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032.
Global key Heat Sink Module players cover Boyd Corporation, Wakefield Thermal, Fischer Elektronik GmbH & Co. KG, Mersen, Advanced Cooling Technologies, Inc. (ACT), etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2025.
Infinity Market Research newest research report, the ?Heat Sink Module Industry Forecast? looks at past sales and reviews total world Heat Sink Module sales in 2025, providing a comprehensive analysis by region and market sector of projected Heat Sink Module sales for 2026 through 2032. With Heat Sink Module sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Heat Sink Module industry.
This Insight Report provides a comprehensive analysis of the global Heat Sink Module landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Heat Sink Module portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms? unique position in an accelerating global Heat Sink Module market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Heat Sink Module and breaks down the forecast by Cooling Mode, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Heat Sink Module.
This report presents a comprehensive overview, market shares, and growth opportunities of Heat Sink Module market by product type, application, key manufacturers and key regions and countries.
Segmentation by Cooling Mode:
Passive Heat Sink
Active Heat Sink
Others
Segmentation by Fin Material:
Aluminum
Copper
Graphite Composite
Others
Segmentation by Fan Configuration:
Fanless
Single Fan
Dual Fan
Segmentation by Power Density Class:
Low Power Density
Medium Power Density
High Power Density
Segmentation by Application:
Consumer Electronics
IT and Data Center
Automotive Electronics
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the companys coverage, product portfolio, its market penetration.
Boyd Corporation
Wakefield Thermal
Fischer Elektronik GmbH & Co. KG
Mersen
Advanced Cooling Technologies, Inc. (ACT)
Delta Electronics, Inc.
Asia Vital Components Co., LTD (AVC)
Auras Technology Co., Ltd.
Sunonwealth Electric Machine Industry Co., Ltd. (SUNON)
Listan GmbH (be quiet!)
ARCTIC GmbH
ZALMAN TECH CO., Ltd.
Rascom Computerdistribution Ges.m.b.H. (Noctua)
Beijing DeepCool Industries Co., Ltd. (DeepCool)
Shenzhen Fluence Technology PLC (PCCOOLER)
Shenzhen Wanjinghua Technology Co., Ltd. (ID-COOLING)
Zerode Heatsink Manufacturing (Shenzhen) Co., Ltd.
Dongguan Tongyu Electronics Co., Ltd.
Dongguan Songde Hardware & Electronics Co., Ltd.
Dongguan Sibosi Tongshi Industrial Co., Ltd. (JONSBO)
Segotep Electronic Technology Co., Ltd.
Key Questions Addressed in this Report
What is the 10-year outlook for the global Heat Sink Module market?
What factors are driving Heat Sink Module market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Heat Sink Module market opportunities vary by end market size?
How does Heat Sink Module break out by Cooling Mode, by Application?
Heat Sink Module Market Scope
| Report Attribute | Details |
|---|---|
| Market Size (Start Year) | USD XX Million |
| Market Size (End Year) | USD XX Million |
| Compound Annual Growth Rate (CAGR) | USD XX Million |
| Forecast Period | USD XX Million |
| Base Year | USD XX Million |
| Historical Data | USD XX Million |
| Key Players | USD XX Million |
REPORT COVERAGE
Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends
SEGMENT COVERED
By component, deployment, organization size, application, and industry.
REGIONAL SCOPE
North America, Europe, Asia Pacific, Middle East & Africa, South & Central America
COUNTRY SCOPE
Includes key countries across all major regions.
📘 Frequently Asked Questions
1. What is the market size of Global Heat Sink Module Market?
Answer: The global Heat Sink Module market size is predicted to grow from US$ 8315 million in 2025 to US$ 13408 million in 2032; it is expected to grow at a CAGR of 7.3% from 2026 to 2032.
2. Which regions are analyzed in the Global Heat Sink Module Market report?
Answer: The Global Heat Sink Module Market report covers major regions such as Europe, Middle East & Africa. Each region is analyzed for trends, opportunities, and market dynamics.
3. What methodology is used for forecasting of Global Heat Sink Module Market?
Answer: The Global Heat Sink Module Market report uses a mix of primary research, secondary data, and expert analysis to build its forecasts. Models include both qualitative and quantitative approaches.
4. Are emerging markets analyzed separately in the Global Heat Sink Module Market?
Answer: Yes, the Global Heat Sink Module Market report highlights high-growth emerging regions with dedicated insights. These include untapped opportunities, risks, and potential for expansion.
5. Does the report include competitive benchmarking of Global Heat Sink Module Market?
Answer: Yes, Global Heat Sink Module Market report compares major players based on revenue, product portfolio, innovation, and regional presence. This helps assess competitive positioning.
6. Can I access country-level data within the Global Heat Sink Module Market report?
Answer: Yes, Global Heat Sink Module Market report includes detailed data by country, especially for key markets. This allows for localized insights and decision-making.
7. Can I get customized insights or data from the Global Heat Sink Module Market report?
Answer: Yes, we offer customization options to align with your specific business needs. You can request tailored sections or regional breakdowns.
🔐 Secure Payment Guaranteed
Safe checkout with trusted global payment methods.
🌟 Why Choose Infinity Market Research?
At Infinity Market Research, we dont just deliver data — we deliver clarity, confidence, and competitive edge.
In a world driven by insights, we help businesses unlock the infinite potential of informed decisions.
Here why global brands, startups, and decision-makers choose us:
Industry-Centric Expertise
With deep domain knowledge across sectors — from healthcare and technology to manufacturing and consumer goods — our team delivers insights that matter.
Custom Research, Not Cookie-Cutter Reports
Every business is unique, and so are its challenges. Thats why we tailor our research to your specific goals, offering solutions that are actionable, relevant, and reliable.
Data You Can Trust
Our research methodology is rigorous, transparent, and validated at every step. We believe in delivering not just numbers, but numbers that drive real impact.
Client-Centric Approach
Your success is our priority. From first contact to final delivery, our team is responsive, collaborative, and committed to your goals — because you re more than a client; you re a partner.
