The global Package Substrates market size is predicted to grow from US$ 13050 million in 2025 to US$ 23298 million in 2032; it is expected to grow at a CAGR of 8.3% from 2026 to 2032.

The Package Substrates is a critical component that bridges the semiconductor die and the main Printed Circuit Board (PCB), providing essential functions like electrical interconnection, power/signal distribution, thermal management, and mechanical support. Major product types are segmented based on packaging technology and application needs, including high-end FCBGA (Flip-Chip Ball Grid Array) for High-Performance Computing (HPC) and server CPUs/GPUs, FCCSP (Flip-Chip Chip Scale Package) for mobile processors and consumer electronics, and WB-BGA (Wire Bonding BGA) for lower-end and memory applications. Applications for FCBGA primarily dominate Data Centers/Servers, AI Accelerators, and high-end PC/Tablets, while FCCSP mainly serves the mobile market, including smartphones and wearables. The core upstream value chain relies on materials, particularly high-performance laminates like ABF (Ajinomoto Build-up Film) and BT (Bismaleimide Triazine) resins, copper foil, and specialty chemicals. Downstream customers include world-leading chip design and manufacturing giants such as Intel, AMD, and NVIDIA (HPC drivers), as well as Apple and Huawei (mobile drivers), and Broadcom and Xilinx (networking/FPGA drivers).

Currently the package substrates are mainly produced by manufactuers headquartered in Japan, South Korea, China Taiwan and China Mainland. China Taiwan is the largest producer of package substrates with global share 28.03% in 2024, followed by South Korea (27.4%), China Mainland (22%) and Japan (17.17%).

The global IC substrate (package substrate) market is structurally segmented by ABF build-up substrates (especially FC-BGA for high-pin-count, large-body packages used in server/AI CPUs, GPUs, networking ASICs), BT resin substrates (widely used in mainstream BGA/CSP for mobile/consumer and many automotive/industrial ICs), plus module/memory-oriented substrates (e.g., SiP/RF modules and memory package substrates) that emphasize high volume, tight dimensional control, and robust reliability. Supply remains highly concentrated in East Asia (Japan/Taiwan/Korea/China), while Europe has selective high-end capacity; the demand mix has been migrating toward larger, more layer-dense, tighter line/space ABF substrates driven by data center compute and heterogeneous integration. In the post-pandemic period, the industry has also shown a split cycle: consumer/PC-related substrate demand can correct quickly, while server/AI-oriented ABF tends to be supported by long qualification cycles and multi-year platform roadmaps. Recent capacity moves (e.g., new high-volume substrate manufacturing ramps tied to data-center processors) underscore that leading suppliers still prioritize high-end ABF investment even when parts of the broader electronics cycle soften.

The global ABF substrates market was valued at US$ 5.4 billion in 2024 and is anticipated to reach US$ 10.5 billion by 2031, witnessing a CAGR of 10.73% during the forecast period 2025-2031.

The global BT substrates market was valued at US$ 7.41 billion in 2024 and is anticipated to reach US$ 10.38 billion by 2031, witnessing a CAGR of 5.56% during the forecast period 2025-2031.

The global MIS substrates market was valued at US$ 96 million in 2024 and is anticipated to reach US$ 255 million by 2031, witnessing a CAGR of 13.62% during the forecast period 2025-2031.

The key global manufacturers of package substrates include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect Technology, AT&S, Samsung Electro-Mechanics, Kyocera, and Toppan, etc. In 2024, the worlds top ten vendors accounted for approximately 77.4% of the revenue.

The global key manufacturers of ABF Substrate include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, AT&S, Semco, Kyocera, and TOPPAN, etc. In 2024, the global top seven players had a share approximately 92.44% in terms of revenue.

The global key manufacturers of MIS Substrate include China Taiwanese PPt, Chineses MiSpak Technology and Malaysian QDOS.

Technology and product trends are increasingly shaped by advanced packaging. The substrate is no longer a passive carrier but a key enabler for chiplets, 2.5D/3D integration, and high-bandwidth memory (HBM) ecosystems, which require more routing density, better warpage control, and higher signal integrity at rising data rates. Industry roadmaps therefore push finer L/S via semi-additive processes (mSAP), improved laser via formation, tighter registration (LDI), thinner cores/coreless structures, and higher layer countsall while maintaining yield and reliability at scale. On the materials side, suppliers are continuously upgrading dielectrics (e.g., ABF-class build-up materials) for lower loss and better thermo-mechanical stability, because substrate performance increasingly gates overall package performance and manufacturability. Meanwhile, the next substrate curve (e.g., glass-core substrates) is being explored to extend wiring density, dimensional stability, and power delivery for future compute packages, signaling that the substrate roadmap is entering a new materials-and-process transition rather than simple incremental scaling.

From a value-chain perspective, the upstream is dominated by dielectric/build-up materials (ABF-type films/resins), BT epoxy systems, copper foil, glass cloth/core laminates, solder masks/photoresists, plating chemicals, and specialized equipment (laser drilling, imaging/LDI, plating lines, lamination/press, AOI/inspection, reliability test). Tightness in any one of theseparticularly advanced build-up dielectrics and high-end process toolscan become a bottleneck, which is why upstream material makers continue to publicize multi-year capacity and technology expansion plans aligned with AI/HPC growth expectations. Downstream, substrates flow into OSATs and IDM/foundry-adjacent advanced packaging lines, then into end markets led by server & data center, HPC/AI accelerators, networking/communication infrastructure, plus cyclical volumes from PCs, smartphones, and automotive electronics. Looking forward, the industrys center of gravity remains in Asia, but policy and supply-chain resilience goals are catalyzing selective localization: the U.S., for example, has backed early-stage domestic manufacturing of glass substrates for advanced packaging, indicating a longer-term push to diversify critical substrate technologies geographically. Near term, demand and utilization will still be uneven by end market (AI strong; consumer more cyclical), but structurally the outlook remains favorable because substrates are increasingly the limiting factor for advanced packaging scalingtechnically, economically, and in capacity build time.

Infinity Market Research newest research report, the Package Substrates Industry Forecast looks at past sales and reviews total world Package Substrates sales in 2025, providing a comprehensive analysis by region and market sector of projected Package Substrates sales for 2026 through 2032. With Package Substrates sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Package Substrates industry.

This Insight Report provides a comprehensive analysis of the global Package Substrates landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Package Substrates portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms unique position in an accelerating global Package Substrates market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Package Substrates and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Package Substrates.

This report presents a comprehensive overview, market shares, and growth opportunities of Package Substrates market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:

    FCBGA Substrate
    FCCSP Substrate
    WB-CSP/BGA
    Segmentation by Substrate Type:
    ABF Substrate
    BT Substrate
    MIS Substrate
    Segmentation by Chips Type:
    Non-memory IC Substrate
    Memory Substrate

Segmentation by Application:

    PCs
    Server/Data Center
    AI/HPC Chips
    Communication
    Smart Phone
    Wearable and Consumer Electronics
    Automotive Electronics
    Others

This report also splits the market by region:

    Americas
        United States
        Canada
        Mexico
        Brazil
    APAC
        China
        Japan
        Korea
        Southeast Asia
        India
        Australia
    Europe
        Germany
        France
        UK
        Italy
        Russia
    Middle East & Africa
        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the companys coverage, product portfolio, its market penetration.

    Unimicron
    Ibiden
    Nan Ya PCB
    Shinko Electric Industries
    Kinsus Interconnect Technology
    AT&S
    Samsung Electro-Mechanics
    Kyocera
    Toppan
    Zhen Ding Technology
    Daeduck Electronics
    Zhuhai Access Semiconductor
    LG InnoTek
    Shennan Circuit
    Shenzhen Fastprint Circuit Tech
    Korea Circuit
    FICT LIMITED
    AKM Meadville
    Shenzhen Hemei Jingyi Semiconductor Technology
    Simmtech
    HOREXS
    ASE Material
    PPt
    MiSpak Technology
    QDOS

Key Questions Addressed in this Report

What is the 10-year outlook for the global Package Substrates market?
What factors are driving Package Substrates market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Package Substrates market opportunities vary by end market size?
How does Package Substrates break out by Type, by Application?