The global Silicon Die-sorting Service market size is predicted to grow from US$ 888 million in 2025 to US$ 1265 million in 2032; it is expected to grow at a CAGR of 5.3% from 2026 to 2032.

Silicon Die-sorting Service refers to a professional service in the semiconductor industry that involves the selection, sorting, and classification of individual silicon dice (or dies) based on their electrical, physical, and/or reliability characteristics. These dice are typically obtained from wafers that have undergone various manufacturing processes, such as photolithography, etching, doping, and metallization, to create the integrated circuits (ICs).

United States market for Silicon Die-sorting Service is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032.

China market for Silicon Die-sorting Service is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032.

Europe market for Silicon Die-sorting Service is estimated to increase from US$ million in 2025 to US$ million by 2032, at a CAGR of % from 2026 through 2032.

Global key Silicon Die-sorting Service players cover American Dicing, Intech Technologies International, KLA-Tencor, YAC Garter, Tresky, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2025.

Infinity Market Research newest research report, the Silicon Die-sorting Service Industry Forecast looks at past sales and reviews total world Silicon Die-sorting Service sales in 2025, providing a comprehensive analysis by region and market sector of projected Silicon Die-sorting Service sales for 2026 through 2032. With Silicon Die-sorting Service sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Silicon Die-sorting Service industry.

This Insight Report provides a comprehensive analysis of the global Silicon Die-sorting Service landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Silicon Die-sorting Service portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms unique position in an accelerating global Silicon Die-sorting Service market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Silicon Die-sorting Service and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Silicon Die-sorting Service.

This report presents a comprehensive overview, market shares, and growth opportunities of Silicon Die-sorting Service market by product type, application, key players and key regions and countries.

Segmentation by Type:

    High Speed Die Sorting
    Standard Speed Die Sorting

Segmentation by Application:

    Integrated Device Manufacturers (IDMs)
    Outsourced Semiconductor Assembly and Test (OSAT)

This report also splits the market by region:

    Americas
        United States
        Canada
        Mexico
        Brazil
    APAC
        China
        Japan
        Korea
        Southeast Asia
        India
        Australia
    Europe
        Germany
        France
        UK
        Italy
        Russia
    Middle East & Africa
        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the companys coverage, product portfolio, its market penetration.

    American Dicing
    Intech Technologies International
    KLA-Tencor
    YAC Garter
    Tresky
    Beckermus Technologies
    SMART Microsystems
    American Precision Dicing
    Mhlbauer Group