According to this study, the global 3D IC and 2.5D IC market size will reach US$ million by 2031.

In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.While a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.

Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.

LPI (LP Information) newest research report, the 3D IC and 2.5D IC Industry Forecast looks at past sales and reviews total world 3D IC and 2.5D IC sales in 2024, providing a comprehensive analysis by region and market sector of projected 3D IC and 2.5D IC sales for 2025 through 2031. With 3D IC and 2.5D IC sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world 3D IC and 2.5D IC industry.

This Insight Report provides a comprehensive analysis of the global 3D IC and 2.5D IC landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on 3D IC and 2.5D IC portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms unique position in an accelerating global 3D IC and 2.5D IC market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for 3D IC and 2.5D IC and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global 3D IC and 2.5D IC.

This report presents a comprehensive overview, market shares, and growth opportunities of 3D IC and 2.5D IC market by product type, application, key players and key regions and countries.

Segmentation by Type:

    3D Wafer-level Chip-scale Packaging
    3D TSV
    2.5D

Segmentation by Application:

    Consumer Electronics
    Telecommunication
    Industry Sector
    Automotive
    Military and Aerospace
    Smart Technologies
    Medical Devices

This report also splits the market by region:

    Americas
        United States
        Canada
        Mexico
        Brazil
    APAC
        China
        Japan
        Korea
        Southeast Asia
        India
        Australia
    Europe
        Germany
        France
        UK
        Italy
        Russia
    Middle East & Africa
        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the companys coverage, product portfolio, its market penetration.

    TSMC(Taiwan)
    Samsung(South Korea)
    Toshiba(Japan)
    ASE Group(Taiwan)
    Amkor(U.S.)
    UMC(Taiwan)
    Stmicroelectronics(Switzerland)
    Broadcom(U.S.)
    Intel(U.S.)
    Jiangsu Changjiang Electronics(China)