The global Embedded Chip Packaging market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.

Embedding components into substrates using a multi-step manufacturing process.Single-chip, multi-chip, MEMS or passive components can be embedded in an organic laminate substrate in a side-by-side manner. These components are connected by copper-plated vias.

Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.

LPI (LP Information) newest research report, the Embedded Chip Packaging Industry Forecast looks at past sales and reviews total world Embedded Chip Packaging sales in 2024, providing a comprehensive analysis by region and market sector of projected Embedded Chip Packaging sales for 2025 through 2031. With Embedded Chip Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Embedded Chip Packaging industry.

This Insight Report provides a comprehensive analysis of the global Embedded Chip Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Embedded Chip Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms unique position in an accelerating global Embedded Chip Packaging market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Embedded Chip Packaging and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Embedded Chip Packaging.

This report presents a comprehensive overview, market shares, and growth opportunities of Embedded Chip Packaging market by product type, application, key players and key regions and countries.

Segmentation by Type:

    Single Chip
    Multichip
    MEMS
    Passive Components

Segmentation by Application:

    Tiny package
    System-in-Boards
    Other

This report also splits the market by region:

    Americas
        United States
        Canada
        Mexico
        Brazil
    APAC
        China
        Japan
        Korea
        Southeast Asia
        India
        Australia
    Europe
        Germany
        France
        UK
        Italy
        Russia
    Middle East & Africa
        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the companys coverage, product portfolio, its market penetration.

    ASE
    ATS
    GE
    Shinko
    Taiyo Yuden
    TDK
    Wrth Elektronik
    Texas Instruments
    Siemens
    Infineon
    ST
    Analog Devices
    NXP
    ATMEL
    Samsung
    MTK
    Allwinner
    Rockchip