The global Epoxy Based Thermal Conductive Adhesives market size is predicted to grow from US$ 437 million in 2025 to US$ 603 million in 2031; it is expected to grow at a CAGR of 5.5% from 2025 to 2031.

The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.

Epoxy Based Thermal Conductive Adhesives is a material that consists of an Epoxy resin mixed with a Thermally conductive material, Thermally conductive adhesives are often used to dissipate heat from power electronics. Used to bond heat sinks, for example, their heat conductivity reduces thermal strain to prevent performance loss or failure of electronic components. Thermally conductive adhesives are also used as encapsulation compound for temperature sensors for enclosures or reactors. Adhesives with thermal conductivity are synthetic resins augmented with metallic or inorganic filler materials. The best thermal conduction coefficients can be achieved with metallic fillers such as silver or graphite. These, however, also make the adhesive electrically conductive, which is undesirable in many applications. To achieve thermal conductivity and electrical insulation at the same time, adhesives augmented with ceramic or mineral-based fillers must be used.

United States market for Epoxy Based Thermal Conductive Adhesives is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for Epoxy Based Thermal Conductive Adhesives is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for Epoxy Based Thermal Conductive Adhesives is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key Epoxy Based Thermal Conductive Adhesives players cover Henkel, H.B. Fuller, 3M Company, Permabond Engineering Adhesives, Masterbond, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

Infinity Market Research newest research report, the Epoxy Based Thermal Conductive Adhesives Industry Forecast looks at past sales and reviews total world Epoxy Based Thermal Conductive Adhesives sales in 2024, providing a comprehensive analysis by region and market sector of projected Epoxy Based Thermal Conductive Adhesives sales for 2025 through 2031. With Epoxy Based Thermal Conductive Adhesives sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Epoxy Based Thermal Conductive Adhesives industry.

This Insight Report provides a comprehensive analysis of the global Epoxy Based Thermal Conductive Adhesives landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Epoxy Based Thermal Conductive Adhesives portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms unique position in an accelerating global Epoxy Based Thermal Conductive Adhesives market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Epoxy Based Thermal Conductive Adhesives and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Epoxy Based Thermal Conductive Adhesives.

This report presents a comprehensive overview, market shares, and growth opportunities of Epoxy Based Thermal Conductive Adhesives market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:

    High Thermal Conductivity Epoxy Based Thermal Conductive Adhesives
    Medium and Low Thermal Conductivity Epoxy Based Thermal Conductive Adhesives

Segmentation by Application:

    Battery Thermal
    Heat Sink
    IC Packaging Heat Conduction
    LED Lighting Thermal
    Thermal Material Potting

This report also splits the market by region:

    Americas
        United States
        Canada
        Mexico
        Brazil
    APAC
        China
        Japan
        Korea
        Southeast Asia
        India
        Australia
    Europe
        Germany
        France
        UK
        Italy
        Russia
    Middle East & Africa
        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the companys coverage, product portfolio, its market penetration.

    Henkel
    H.B. Fuller
    3M Company
    Permabond Engineering Adhesives
    Masterbond
    Creative Materials Inc.
    Panacol-Elosol GmbH
    DOW Corning
    Polytec PT GmbH
    Lord Corporation

Key Questions Addressed in this Report

What is the 10-year outlook for the global Epoxy Based Thermal Conductive Adhesives market?
What factors are driving Epoxy Based Thermal Conductive Adhesives market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Epoxy Based Thermal Conductive Adhesives market opportunities vary by end market size?
How does Epoxy Based Thermal Conductive Adhesives break out by Type, by Application?