The global Forced Air Convection Reflow Ovens market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.
The Forced Air Convection Reflow oven systems use re-circulated hot air to accomplish reflow at much lower temperatures than IR systems. Using constant, even heating, a great variety of board sizes will reach re-flow temperature with the same heat profile.
Forced air convection reflow ovens are a type of reflow ovens that use hot air to heat and melt the solder paste on the printed circuit boards (PCBs). Reflow ovens are devices that are used to solder the surface mount components (SMCs) onto the PCBs in the electronic assembly process. Forced air convection reflow ovens have fans or blowers that circulate the hot air inside the oven chamber, creating a uniform temperature profile and ensuring a high-quality soldering result. The industry trend of forced air convection reflow ovens is expected to grow in the coming years, as they offer advantages such as high efficiency, low power consumption, fast heating and cooling, and precise temperature control. They can also handle different types of PCBs and SMCs, such as lead-free, fine-pitch, or BGA (ball grid array) components. The demand for forced air convection reflow ovens is driven by factors such as the increasing demand for electronic devices and equipment, the rising adoption of automation and digitalization, the innovation of new products and features, and the expansion of end-user industries such as telecommunications, automotive, medical, industrial, etc. .Forced air convection reflow ovens are a significant segment of this market, as they are widely used in various applications such as SMT (surface mount technology), LED (light emitting diode), etc. .