The global Fully Automatic Semiconductor Molding Equipment market size is predicted to grow from US$ 301 million in 2025 to US$ 388 million in 2031; it is expected to grow at a CAGR of 4.4% from 2025 to 2031.

According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.

Infinity Market Research newest research report, the Fully Automatic Semiconductor Molding Equipment Industry Forecast looks at past sales and reviews total world Fully Automatic Semiconductor Molding Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Fully Automatic Semiconductor Molding Equipment sales for 2025 through 2031. With Fully Automatic Semiconductor Molding Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Fully Automatic Semiconductor Molding Equipment industry.

This Insight Report provides a comprehensive analysis of the global Fully Automatic Semiconductor Molding Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Fully Automatic Semiconductor Molding Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms unique position in an accelerating global Fully Automatic Semiconductor Molding Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Fully Automatic Semiconductor Molding Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Fully Automatic Semiconductor Molding Equipment.

This report presents a comprehensive overview, market shares, and growth opportunities of Fully Automatic Semiconductor Molding Equipment market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:

    Hydraulic Semiconductor Molding System
    Electric Semiconductor Molding System

Segmentation by Application:

    Wafer Level Packaging
    BGA Packaging
    Flat Panel Packaging
    Others

This report also splits the market by region:

    Americas
        United States
        Canada
        Mexico
        Brazil
    APAC
        China
        Japan
        Korea
        Southeast Asia
        India
        Australia
    Europe
        Germany
        France
        UK
        Italy
        Russia
    Middle East & Africa
        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the companys coverage, product portfolio, its market penetration.

    TOWA
    ASMPT
    Besi
    I-PEX
    Yamada
    TAKARA TOOL & DIE
    Asahi Engineering
    Tongling Fushi Sanjia
    Nextool Technology
    DAHUA Technology

Key Questions Addressed in this Report

What is the 10-year outlook for the global Fully Automatic Semiconductor Molding Equipment market?
What factors are driving Fully Automatic Semiconductor Molding Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Fully Automatic Semiconductor Molding Equipment market opportunities vary by end market size?
How does Fully Automatic Semiconductor Molding Equipment break out by Type, by Application?