The global IC Substrates for Memory market size is predicted to grow from US$ 25.9 million in 2025 to US$ 36.9 million in 2031; it is expected to grow at a CAGR of 6.1% from 2025 to 2031.

Semiconductor package substrates (IC substrates) play an important role in protecting IC chips from the surrounding environment, ensuring electrical connection for chip mount on printed wiring boards. Demand for high-speed, high-integration and low power consumption of ICs accompanying the rapid progress of electronics technology such as AI, Cloud computing, Intelligentization of automobiles, and due to the miniaturization and thinning of electronic devices typified by smart phone and wearable devices, semiconductor packages are required further high density, multilayer, low-profile.

This report studies the IC substrates for memory (also called memory substrate), including WBCSP, WB-BGA, and FCCSP, used in DRAM (Volatile memory), NAND Flash (Solid-state Drive, Embedded Storage, and Mobile Memory).

United States market for IC Substrates for Memory is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for IC Substrates for Memory is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for IC Substrates for Memory is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key IC Substrates for Memory players cover Unimicron, Samsung Electro-Mechanics, Nan Ya PCB, Shinko Electric Industries, Zhen Ding Technology, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

Infinity Market Research newest research report, the IC Substrates for Memory Industry Forecast looks at past sales and reviews total world IC Substrates for Memory sales in 2024, providing a comprehensive analysis by region and market sector of projected IC Substrates for Memory sales for 2025 through 2031. With IC Substrates for Memory sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world IC Substrates for Memory industry.

This Insight Report provides a comprehensive analysis of the global IC Substrates for Memory landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on IC Substrates for Memory portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms unique position in an accelerating global IC Substrates for Memory market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for IC Substrates for Memory and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global IC Substrates for Memory.

This report presents a comprehensive overview, market shares, and growth opportunities of IC Substrates for Memory market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:

    WB-CSP
    WB-BGA
    FCCSP

Segmentation by Application:

    DRAM
    Solid-state Drive
    Embedded Storage
    Mobile Memory
    Others

This report also splits the market by region:

    Americas
        United States
        Canada
        Mexico
        Brazil
    APAC
        China
        Japan
        Korea
        Southeast Asia
        India
        Australia
    Europe
        Germany
        France
        UK
        Italy
        Russia
    Middle East & Africa
        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the companys coverage, product portfolio, its market penetration.

    Unimicron
    Samsung Electro-Mechanics
    Nan Ya PCB
    Shinko Electric Industries
    Zhen Ding Technology
    Daeduck Electronics
    LG InnoTek
    DAISHO DENSHI
    Korea Circuit
    Shennan Circuit
    Shenzhen Fastprint Circuit Tech
    Shenzhen Hemei Jingyi Semiconductor Technology
    Hong Yuen Electronics
    Huizhou China Eagle Electronic Technology

Key Questions Addressed in this Report

What is the 10-year outlook for the global IC Substrates for Memory market?
What factors are driving IC Substrates for Memory market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do IC Substrates for Memory market opportunities vary by end market size?
How does IC Substrates for Memory break out by Type, by Application?