The global Low Pressure Molding Adhesive market size is predicted to grow from US$ 280 million in 2025 to US$ 452 million in 2031; it is expected to grow at a CAGR of 8.3% from 2025 to 2031.

The low-pressure injection molding process is a packaging process that uses very low injection pressure to inject hot melt adhesive material into the mold and quickly solidify and mold (the speed is only 1-50 seconds). It uses hot melt adhesive as the material, has excellent sealing and excellent physical properties, and the product performance has achieved insulation, temperature resistance, impact resistance, shock absorption, moisture resistance, waterproof, dustproof, chemical corrosion resistance and other effects.

This process is currently mainly used for the packaging and protection of precision and sensitive electronic components, including: printed circuit boards (PCBs), automotive electronics, mobile phone batteries, wiring harnesses, waterproof connectors, sensors, micro switches, inductors, antennas, etc.

Low-pressure injection molding plays a good protective role for electronic components. The traditional injection molding process is defective due to excessive pressure. Because low-pressure molding only requires a small pressure to make the melt flow into a small mold space, it will not damage the fragile components that need to be encapsulated, greatly reducing the scrap rate. The low-pressure injection molding process is not only environmentally friendly, but also greatly improves production efficiency and can help reduce the total production cost.

Low-pressure molding adhesives, this material is able to reach small areas without high pressure, making it ideal for sensitive components. The adhesive properties of polyamide provide the best adhesion and can effectively seal out moisture and other environmental contaminants. The high chemical resistance of low-pressure molding hot melt adhesives represented by polyamide to oil, diesel, grease and mild acids also improves the performance of the finished product.

From the historical data, due to the downturn in the consumer electronics industry and the cumulative impact of the COVID-19 pandemic, the development of low-pressure molding adhesives slowed down from 2019 to 2021, and the market entered an adjustment period. Since 2021, with the development of the new energy vehicle industry and the electrification transformation of automobiles, the industry has once again ushered in a new growth point; at the same time, the consumer electronics industry has also ushered in new growth opportunities with home office and study.

From a regional perspective, the Chinese market has changed rapidly in the past few years, accounting for about 24% of the world.

China is in a leading position in the electronics, new energy vehicles and semiconductor packaging industries, so the demand for low-pressure molding adhesives is relatively strong. It is also the current largest market, and there is still a lot of room for growth in the future.

In terms of product type and technology, polyamide occupies a major market share, accounting for 90.00% of the overall market.

At present, the worlds major manufacturers include Henkel, Bostik (Arkema), Huntsman, etc. In 2022, the share of major manufacturers will exceed 83%. It is expected that industry competition will be more intense in the next few years, especially in the Chinese market.

The electrification of the automotive industry has brought new development directions to the low-pressure molding adhesive industry; due to its particularity, the automotive industry has high requirements for the durability and stability of parts, so the low-pressure molding process has a good application prospect; and with the new energy revolution in the automotive industry, more and more electronic devices are beginning to be used in automobiles, thus bringing new development opportunities for the low-pressure molding process. In addition, the sales of electronics and automotive industries in the Asia-Pacific region have grown rapidly in recent years, and the sales of low-pressure molding hot melt adhesives may increase significantly in the future.

Infinity Market Research newest research report, the Low Pressure Molding Adhesive Industry Forecast looks at past sales and reviews total world Low Pressure Molding Adhesive sales in 2024, providing a comprehensive analysis by region and market sector of projected Low Pressure Molding Adhesive sales for 2025 through 2031. With Low Pressure Molding Adhesive sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Low Pressure Molding Adhesive industry.

This Insight Report provides a comprehensive analysis of the global Low Pressure Molding Adhesive landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Low Pressure Molding Adhesive portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms unique position in an accelerating global Low Pressure Molding Adhesive market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Low Pressure Molding Adhesive and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Low Pressure Molding Adhesive.

This report presents a comprehensive overview, market shares, and growth opportunities of Low Pressure Molding Adhesive market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:

    TPU
    PO

Segmentation by Application:

    Consumer electronics
    Automotive
    Medical Devices
    Other

This report also splits the market by region:

    Americas
        United States
        Canada
        Mexico
        Brazil
    APAC
        China
        Japan
        Korea
        Southeast Asia
        India
        Australia
    Europe
        Germany
        France
        UK
        Italy
        Russia
    Middle East & Africa
        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the companys coverage, product portfolio, its market penetration.

    Henkel
    Bostik
    Huntsman
    SUNTIP
    Liri New Chemical Materials
    Bhnen
    Darbond
    KY Chemical

Key Questions Addressed in this Report

What is the 10-year outlook for the global Low Pressure Molding Adhesive market?
What factors are driving Low Pressure Molding Adhesive market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Low Pressure Molding Adhesive market opportunities vary by end market size?
How does Low Pressure Molding Adhesive break out by Type, by Application?