The global Non-Conductive Die Attach Paste market size is predicted to grow from US$ 412 million in 2025 to US$ 532 million in 2031; it is expected to grow at a CAGR of 4.4% from 2025 to 2031.

Non-conductive die attach paste is a specialized adhesive material used in semiconductor and electronic packaging to securely bond dies (chips) to substrates or packages while providing electrical insulation. Formulated with materials such as epoxy resins filled with thermally conductive but electrically insulating particles, this paste ensures excellent adhesion, thermal management, and mechanical stability. Non-conductive die attach paste is commonly used in applications like LEDs, MEMS devices, and other high-performance electronics, where maintaining electrical isolation between components is critical. Its reliable performance under thermal and mechanical stresses makes it an essential material for advanced electronic manufacturing.

United States market for Non-Conductive Die Attach Paste is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for Non-Conductive Die Attach Paste is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for Non-Conductive Die Attach Paste is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key Non-Conductive Die Attach Paste players cover SMIC, Alpha Assembly Solutions, Shenmao Technology, Henkel, Indium, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LP Information, Inc. (LPI) ' newest research report, the “Non-Conductive Die Attach Paste Industry Forecast” looks at past sales and reviews total world Non-Conductive Die Attach Paste sales in 2024, providing a comprehensive analysis by region and market sector of projected Non-Conductive Die Attach Paste sales for 2025 through 2031. With Non-Conductive Die Attach Paste sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Non-Conductive Die Attach Paste industry.

This Insight Report provides a comprehensive analysis of the global Non-Conductive Die Attach Paste landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Non-Conductive Die Attach Paste portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Non-Conductive Die Attach Paste market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Non-Conductive Die Attach Paste and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Non-Conductive Die Attach Paste.

This report presents a comprehensive overview, market shares, and growth opportunities of Non-Conductive Die Attach Paste market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:

    No-Clean Pastes
    Rosin Based Pastes
    Water Soluble Pastes
    Others

Segmentation by Application:

    Consumer Electronics
    Automotive
    Medical
    Others

This report also splits the market by region:

    Americas

        United States
        Canada
        Mexico
        Brazil

    APAC

        China
        Japan
        Korea
        Southeast Asia
        India
        Australia

    Europe

        Germany
        France
        UK
        Italy
        Russia

    Middle East & Africa

        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.

    SMIC
    Alpha Assembly Solutions
    Shenmao Technology
    Henkel
    Indium
    Tongfang Tech
    Heraeu
    Sumitomo Bakelite
    AIM
    Tamura
    Asahi Solder
    Kyocera
    NAMICS
    Hitachi Chemical
    Nordson EFD
    Dow
    Inkron
    Palomar Technologies

Key Questions Addressed in this Report

What is the 10-year outlook for the global Non-Conductive Die Attach Paste market?
What factors are driving Non-Conductive Die Attach Paste market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Non-Conductive Die Attach Paste market opportunities vary by end market size?
How does Non-Conductive Die Attach Paste break out by Type, by Application?