The global Plastic Carrier Tape for Active Components market size is predicted to grow from US$ 896 million in 2025 to US$ 1244 million in 2031; it is expected to grow at a CAGR of 5.6% from 2025 to 2031.

Paper carrier tape and plastic carrier tape are mainly used for packaging passive and active components, respectively. According to their different reactions to current, electronic component products can be divided into two categories: passive electronic components and active electronic components. Among them, passive electronic components are a type of component that only consumes input signal power and can process and transmit signals without the need for a power source. They are also known as passive components; Active electronic components require devices to provide corresponding power, also known as active devices. There are many types and specifications of electronic components, and there are also many specifications of thin carrier tapes that come with them. According to the different raw materials used, thin carrier tapes are mainly divided into paper carrier tapes and plastic carrier tapes. When the thickness of electronic components exceeds 1mm, considering the bending conditions and thickness limitations of paper carrier tapes, plastic carrier tapes are generally used for packaging. Plastic carrier tapes are suitable for active components such as integrated circuits, semiconductor products, and passive components with larger thicknesses.

United States market for Plastic Carrier Tape for Active Components is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for Plastic Carrier Tape for Active Components is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for Plastic Carrier Tape for Active Components is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key Plastic Carrier Tape for Active Components players cover 3M, Advantek, Shin-Etsu, C-Pak, ROTHE, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LP Information, Inc. (LPI) ' newest research report, the “Plastic Carrier Tape for Active Components Industry Forecast” looks at past sales and reviews total world Plastic Carrier Tape for Active Components sales in 2024, providing a comprehensive analysis by region and market sector of projected Plastic Carrier Tape for Active Components sales for 2025 through 2031. With Plastic Carrier Tape for Active Components sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Plastic Carrier Tape for Active Components industry.

This Insight Report provides a comprehensive analysis of the global Plastic Carrier Tape for Active Components landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Plastic Carrier Tape for Active Components portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Plastic Carrier Tape for Active Components market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Plastic Carrier Tape for Active Components and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Plastic Carrier Tape for Active Components.

This report presents a comprehensive overview, market shares, and growth opportunities of Plastic Carrier Tape for Active Components market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:

    Polycarbonate
    Polystyrene
    Others

Segmentation by Application:

    Discrete Components
    Integrated Circuit
    LED
    Sensor
    Others

This report also splits the market by region:

    Americas

        United States
        Canada
        Mexico
        Brazil

    APAC

        China
        Japan
        Korea
        Southeast Asia
        India
        Australia

    Europe

        Germany
        France
        UK
        Italy
        Russia

    Middle East & Africa

        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.

    3M
    Advantek
    Shin-Etsu
    C-Pak
    ROTHE
    Sumitomo Bakelite
    Tek Pack
    Oji F-Tex
    Asahi Kasei
    Taiwan Carrier Tape Enterprise
    LaserTek
    Zhejiang Jiemei Electronic and Technology
    U-Pak
    Jiangyin Winpack Technology
    Xiamen haidelong electronics Limited

Key Questions Addressed in this Report

What is the 10-year outlook for the global Plastic Carrier Tape for Active Components market?
What factors are driving Plastic Carrier Tape for Active Components market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Plastic Carrier Tape for Active Components market opportunities vary by end market size?
How does Plastic Carrier Tape for Active Components break out by Type, by Application?