The global Semiconductor Advanced Packaging Materials market size is predicted to grow from US$ 15320 million in 2025 to US$ 28010 million in 2031; it is expected to grow at a CAGR of 10.6% from 2025 to 2031.

Traditional semiconductor packaging materials mainly include packaging substrates, lead frames, bonding wires, ceramic packaging materials, chip bonding materials, etc. The packaging materials in the advanced packaging field (FC, WB, WLCSP, etc.) are mainly packaging substrates (ABF), underfill, die attach materials (paste and wire), epoxy molding compounds, etc.

United States market for Semiconductor Advanced Packaging Materials is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for Semiconductor Advanced Packaging Materials is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for Semiconductor Advanced Packaging Materials is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key Semiconductor Advanced Packaging Materials players cover Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LPI (LP Information) newest research report, the Semiconductor Advanced Packaging Materials Industry Forecast looks at past sales and reviews total world Semiconductor Advanced Packaging Materials sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Advanced Packaging Materials sales for 2025 through 2031. With Semiconductor Advanced Packaging Materials sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Advanced Packaging Materials industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Advanced Packaging Materials landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Semiconductor Advanced Packaging Materials portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms unique position in an accelerating global Semiconductor Advanced Packaging Materials market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Advanced Packaging Materials and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Advanced Packaging Materials.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Advanced Packaging Materials market by product type, application, key players and key regions and countries.

Segmentation by Type:

    FC Package Substrate (FC-CSP and ABF)
    WB Package Substrate (WB-BGA)
    Underfill
    Die Attach Material (Paste and Wire)
    Epoxy Molding Compound
    Others

Segmentation by Application:

    Consumer Electronics
    Automotive
    IoT
    5G
    High Performance Computing
    Others

This report also splits the market by region:

    Americas
        United States
        Canada
        Mexico
        Brazil
    APAC
        China
        Japan
        Korea
        Southeast Asia
        India
        Australia
    Europe
        Germany
        France
        UK
        Italy
        Russia
    Middle East & Africa
        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the companys coverage, product portfolio, its market penetration.

    Unimicron
    Ibiden
    Nan Ya PCB
    Shinko Electric Industries
    Kinsus Interconnect
    AT&S
    Semco
    Kyocera
    TOPPAN
    Zhen Ding Technology
    Daeduck Electronics
    Zhuhai Access Semiconductor
    LG InnoTek
    Shennan Circuit
    Shenzhen Fastprint Circuit Tech
    Henkel
    Won Chemical
    NAMICS
    Resonac
    Panasonic
    MacDermid Alpha
    Shin-Etsu Chemical
    Sunstar
    Fuji Chemical
    Zymet
    Threebond
    AIM Solder
    LORD Corporation
    SMIC Senju Metal Industry Co., Ltd
    Shenmao Technology
    Heraeu
    Sumitomo Bakelite
    Indium
    Tamura
    Shanghai Doitech
    KCC
    Eternal Materials
    NAGASE
    Hysol Huawei Electronics
    Jiangsu HHCK Advanced Materials