The global Semiconductor Assembly and Test Equipment market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.

The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.

The rapid expansion of semiconductor chip application is one of the primary factors contributing to the growth of the semiconductor packaging and test market in the world. The use of semiconductor chips has expanded broadly with rising demands from various industries such as power, energy, medical, green cars, networking and telecommunications, LED lighting, automobile, consumer applications, military, aerospace and defense, motor control applications, and robotics.

Factors including Convergence of electronics and automotive industry driving the quest for semiconductor manufacturing is significantly driving the global semiconductor manufacturing equipment market. However, the rapidly changing nature of technology requiring consistent changes in manufacturing equipment is impeding the market growth.

This report studies the semiconductor assembly and test equipment.

According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.

Infinity Market Research newest research report, the Semiconductor Assembly and Test Equipment Industry Forecast looks at past sales and reviews total world Semiconductor Assembly and Test Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Assembly and Test Equipment sales for 2025 through 2031. With Semiconductor Assembly and Test Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Assembly and Test Equipment industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Assembly and Test Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Assembly and Test Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms unique position in an accelerating global Semiconductor Assembly and Test Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Assembly and Test Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Assembly and Test Equipment.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Assembly and Test Equipment market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:

    Wafer Probe Station
    Die Bonder
    Dicing Machine
    Test handler
    Sorter
    Others

Segmentation by Application:

    Integrated Device Manufacturer (IDMs)
    Outsourced Semiconductor Assembly and Test (OSAT)
    Foundry

This report also splits the market by region:

    Americas
        United States
        Canada
        Mexico
        Brazil
    APAC
        China
        Japan
        Korea
        Southeast Asia
        India
        Australia
    Europe
        Germany
        France
        UK
        Italy
        Russia
    Middle East & Africa
        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the companys coverage, product portfolio, its market penetration.

    ASM Pacific Technology
    Kulicke & Soffa Industries
    Besi
    ACCRETECH
    SHINKAWA
    Palomar Technologies
    Hesse Mechatronics
    Toray Engineering
    West Bond
    HYBOND
    DIAS Automation
    Teradyne
    Advantest
    Cohu
    Chroma
    Hangzhou Changchuan Technology
    Beijing Huafeng Test and Control Technology
    Shibasoku
    Powertech
    SPEA

Key Questions Addressed in this Report

What is the 10-year outlook for the global Semiconductor Assembly and Test Equipment market?
What factors are driving Semiconductor Assembly and Test Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Semiconductor Assembly and Test Equipment market opportunities vary by end market size?
How does Semiconductor Assembly and Test Equipment break out by Type, by Application?