The global Semiconductor Packaging and Testing Service market size is predicted to grow from US$ 119810 million in 2025 to US$ 164800 million in 2031; it is expected to grow at a CAGR of 5.5% from 2025 to 2031.

A process wherein a semiconductor chip is packaged in a form suitable for the electronic device.

Semiconductor packaging is a process of protecting the chip from the external environment, and electrically packaging it to connect the terminals. The integrated circuit (IC) is a component of circuit boards and electronic devices. ICs need to be electrically packaged in a form fitting to where they?re installed. They are responsible for interconnects, supplying electrical power, and heat dissipation. Packaging also protects the semiconductor chips, shielding the integrated circuits from external factors such as high temperatures, impurities, and physical impact. Each chip is tested to verify normal operation after the packaging process has been completed. This testing is called the package test. The package test is conducted on finished chip products. Chips are placed in a testing apparatus and tested under various conditions to sort out defective products.

The semiconductor industry chain mainly includes three major processes: chip design, chip manufacturing, and packaging and testing. According to the different business models of packaging and testing companies, the business model is divided into two types: IDM and OSAT.

This report studies the Semiconductor Packaging and Testing Service.

The key IDMs include Samsung-Memory, Intel, SK Hynix, Micron Technology, Texas Instruments (TI), STMicroelectronics, Kioxia, Sony Semiconductor Solutions Corporation (SSS), Infineon, NXP, Analog Devices, Inc. (ADI), Renesas Electronics, Microchip Technology and Onsemi; and the key OSATs include ASE (SPIL), Amkor, JCET (STATS ChipPAC), Tongfu Microelectronics (TFME), Powertech Technology Inc. (PTI), Carsem, King Yuan Electronics Corp. (KYEC), SFA Semicon, Unisem Group, Chipbond Technology Corporation and ChipMOS TECHNOLOGIES, etc.

Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.27% year-on-year.

LPI (LP Information)' newest research report, the ?Semiconductor Packaging and Testing Service Industry Forecast? looks at past sales and reviews total world Semiconductor Packaging and Testing Service sales in 2024, providing a comprehensive analysis by region and market sector of projected Semiconductor Packaging and Testing Service sales for 2025 through 2031. With Semiconductor Packaging and Testing Service sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Packaging and Testing Service industry.

This Insight Report provides a comprehensive analysis of the global Semiconductor Packaging and Testing Service landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Semiconductor Packaging and Testing Service portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms? unique position in an accelerating global Semiconductor Packaging and Testing Service market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Packaging and Testing Service and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Packaging and Testing Service.

This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Packaging and Testing Service market by product type, application, key players and key regions and countries.

Segmentation by Type:

    IDM
    OSAT

Segmentation by Application:

    Analog IC
    Micro IC
    Logic IC
    Memory IC
    Discrete Semiconductors
    Optoelectronics
    Sensors

This report also splits the market by region:

    Americas
        United States
        Canada
        Mexico
        Brazil
    APAC
        China
        Japan
        Korea
        Southeast Asia
        India
        Australia
    Europe
        Germany
        France
        UK
        Italy
        Russia
    Middle East & Africa
        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.

    Samsung
    Intel
    SK Hynix
    Micron Technology
    Texas Instruments (TI)
    STMicroelectronics
    Kioxia
    Western Digital
    Infineon
    NXP
    Analog Devices, Inc. (ADI)
    Renesas
    Microchip Technology
    Onsemi
    Sony Semiconductor Solutions Corporation
    Panasonic
    Winbond
    Nanya Technology
    ISSI (Integrated Silicon Solution Inc.)
    Macronix
    Giantec Semiconductor
    Sharp
    Magnachip
    Toshiba
    JS Foundry KK.
    Hitachi
    Murata
    Skyworks Solutions Inc
    Wolfspeed
    Littelfuse
    Diodes Incorporated
    Rohm
    Fuji Electric
    Vishay Intertechnology
    Mitsubishi Electric
    Nexperia
    Ampleon
    CR Micro
    Hangzhou Silan Integrated Circuit
    ASE (SPIL)
    Amkor
    JCET (STATS ChipPAC)
    Tongfu Microelectronics (TFME)
    Powertech Technology Inc. (PTI)
    Carsem
    King Yuan Electronics Corp. (KYEC)
    SFA Semicon
    Unisem Group
    Chipbond Technology Corporation
    ChipMOS TECHNOLOGIES
    OSE CORP.
    Sigurd Microelectronics
    Natronix Semiconductor Technology
    Nepes
    Forehope Electronic (Ningbo) Co.,Ltd.
    Union Semiconductor?Hefei?Co., Ltd.
    Hefei Chipmore Technology Co.,Ltd.
    HT-tech
    Chippacking