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Global Thin Carrier Tape for Electronic Components Market Growth 2025-2031
Sep 2025
Semiconductor and Electronics
Pages: 145
LPI2574
The global Thin Carrier Tape for Electronic Components market size is predicted to grow from US$ 1283 million in 2025 to US$ 1862 million in 2031; it is expected to grow at a CAGR of 6.4% from 2025 to 2031.
Explore this report in detail? Download a free sample copy
Download Free Sample ReportPaper carrier tape and plastic carrier tape are mainly used for packaging passive and active components, respectively. According to their different reactions to current, electronic component products can be divided into two categories: passive electronic components and active electronic components. Among them, passive electronic components are a type of component that only consumes input signal power and can process and transmit signals without the need for a power source. They are also known as passive components; Active electronic components require devices to provide corresponding power, also known as active devices. There are many types and specifications of electronic components, and there are also many specifications of thin carrier tapes that come with them. According to the different raw materials used, thin carrier tapes are mainly divided into paper carrier tapes and plastic carrier tapes. Paper carrier tapes have the characteristics of low price and easy recycling, and are preferred by electronic component manufacturers. They can be used for packaging electronic components with a thickness of no more than 1mm, mainly suitable for passive components such as RCL devices (resistors, capacitors, inductors); When the thickness of electronic components exceeds 1mm, considering the bending conditions and thickness limitations of paper carrier tapes, plastic carrier tapes are generally used for packaging. Plastic carrier tapes are suitable for active components such as integrated circuits, semiconductor products, and passive components with larger thicknesses. In addition, paper carrier tapes need to be used in conjunction with upper and lower tapes, while plastic carrier tapes need to be used in conjunction with upper cover tapes.
United States market for Thin Carrier Tape for Electronic Components is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for Thin Carrier Tape for Electronic Components is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for Thin Carrier Tape for Electronic Components is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key Thin Carrier Tape for Electronic Components players cover 3M, Advantek, Sumitomo Bakelite, DENKA, Shin-Etsu, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
LP Information, Inc. (LPI) ' newest research report, the “Thin Carrier Tape for Electronic Components Industry Forecast” looks at past sales and reviews total world Thin Carrier Tape for Electronic Components sales in 2024, providing a comprehensive analysis by region and market sector of projected Thin Carrier Tape for Electronic Components sales for 2025 through 2031. With Thin Carrier Tape for Electronic Components sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Thin Carrier Tape for Electronic Components industry.
This Insight Report provides a comprehensive analysis of the global Thin Carrier Tape for Electronic Components landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Thin Carrier Tape for Electronic Components portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Thin Carrier Tape for Electronic Components market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Thin Carrier Tape for Electronic Components and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Thin Carrier Tape for Electronic Components.
This report presents a comprehensive overview, market shares, and growth opportunities of Thin Carrier Tape for Electronic Components market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Plastic Carrier Tape
Paper Carrier Tape
Segmentation by Application:
Passive Component Packaging
Active Component Packaging
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
3M
Advantek
Sumitomo Bakelite
DENKA
Shin-Etsu
Asahi Kasei
C-Pak
Tek Pack
ITW ECPS
ROTHE
Hwa Shu Enterpris
Zhejiang Jiemei Electronic and Technology
Taiwan Carrier Tape Enterprise
U-Pak
Carrier Tech Precision
LaserTek
Jiangyin Winpack Technology
Xiamen haidelong electronics Limited
Key Questions Addressed in this Report
What is the 10-year outlook for the global Thin Carrier Tape for Electronic Components market?
What factors are driving Thin Carrier Tape for Electronic Components market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Thin Carrier Tape for Electronic Components market opportunities vary by end market size?
How does Thin Carrier Tape for Electronic Components break out by Type, by Application?
Thin Carrier Tape for Electronic Components Market Scope
| Report Attribute | Details |
|---|---|
| Market Size (Start Year) | USD XX Million |
| Market Size (End Year) | USD XX Million |
| Compound Annual Growth Rate (CAGR) | USD XX Million |
| Forecast Period | USD XX Million |
| Base Year | USD XX Million |
| Historical Data | USD XX Million |
| Key Players | USD XX Million |
REPORT COVERAGE
Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends
SEGMENT COVERED
By component, deployment, organization size, application, and industry.
REGIONAL SCOPE
North America, Europe, Asia Pacific, Middle East & Africa, South & Central America
COUNTRY SCOPE
Includes key countries across all major regions.
📘 Frequently Asked Questions
1. What is the market size of Global Thin Carrier Tape for Electronic Components Market?
Answer: The global Thin Carrier Tape for Electronic Components market size is predicted to grow from US$ 1283 million in 2025 to US$ 1862 million in 2031; it is expected to grow at a CAGR of 6.4% from 2025 to 2031.Paper carrier tape and plastic carrier tape are mainly used for packaging passive and active components, respectively. According to their different reactions to current, electronic component products can be divided into two categories: passive electronic components and active electronic components. Among them, passive electronic components are a type of component that only consumes input signal power and can process and transmit signals without the need for a power source. They are also known as passive components; Active electronic components require devices to provide corresponding power, also known as active devices. There are many types and specifications of electronic components, and there are also many specifications of thin carrier tapes that come with them. According to the different raw materials used, thin carrier tapes are mainly divided into paper carrier tapes and plastic carrier tapes. Paper carrier tapes have the characteristics of low price and easy recycling, and are preferred by electronic component manufacturers. They can be used for packaging electronic components with a thickness of no more than 1mm, mainly suitable for passive components such as RCL devices (resistors, capacitors, inductors); When the thickness of electronic components exceeds 1mm, considering the bending conditions and thickness limitations of paper carrier tapes, plastic carrier tapes are generally used for packaging. Plastic carrier tapes are suitable for active components such as integrated circuits, semiconductor products, and passive components with larger thicknesses. In addition, paper carrier tapes need to be used in conjunction with upper and lower tapes, while plastic carrier tapes need to be used in conjunction with upper cover tapes.United States market for Thin Carrier Tape for Electronic Components is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.China market for Thin Carrier Tape for Electronic Components is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.Europe market for Thin Carrier Tape for Electronic Components is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.Global key Thin Carrier Tape for Electronic Components players cover 3M, Advantek, Sumitomo Bakelite, DENKA, Shin-Etsu, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.LP Information, Inc. (LPI) ' newest research report, the “Thin Carrier Tape for Electronic Components Industry Forecast” looks at past sales and reviews total world Thin Carrier Tape for Electronic Components sales in 2024, providing a comprehensive analysis by region and market sector of projected Thin Carrier Tape for Electronic Components sales for 2025 through 2031. With Thin Carrier Tape for Electronic Components sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Thin Carrier Tape for Electronic Components industry.This Insight Report provides a comprehensive analysis of the global Thin Carrier Tape for Electronic Components landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Thin Carrier Tape for Electronic Components portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Thin Carrier Tape for Electronic Components market.This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Thin Carrier Tape for Electronic Components and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Thin Carrier Tape for Electronic Components.This report presents a comprehensive overview, market shares, and growth opportunities of Thin Carrier Tape for Electronic Components market by product type, application, key manufacturers and key regions and countries.Segmentation by Type: Plastic Carrier Tape
2. Which regions are analyzed in the Global Thin Carrier Tape for Electronic Components Market report?
Answer: The Global Thin Carrier Tape for Electronic Components Market report covers major regions such as Europe. Each region is analyzed for trends, opportunities, and market dynamics.
3. What methodology is used for forecasting of Global Thin Carrier Tape for Electronic Components Market?
Answer: The Global Thin Carrier Tape for Electronic Components Market report uses a mix of primary research, secondary data, and expert analysis to build its forecasts. Models include both qualitative and quantitative approaches.
4. Are emerging markets analyzed separately in the Global Thin Carrier Tape for Electronic Components Market?
Answer: Yes, the Global Thin Carrier Tape for Electronic Components Market report highlights high-growth emerging regions with dedicated insights. These include untapped opportunities, risks, and potential for expansion.
5. Does the report include competitive benchmarking of Global Thin Carrier Tape for Electronic Components Market?
Answer: Yes, Global Thin Carrier Tape for Electronic Components Market report compares major players based on revenue, product portfolio, innovation, and regional presence. This helps assess competitive positioning.
6. Can I access country-level data within the Global Thin Carrier Tape for Electronic Components Market report?
Answer: Yes, Global Thin Carrier Tape for Electronic Components Market report includes detailed data by country, especially for key markets. This allows for localized insights and decision-making.
7. Can I get customized insights or data from the Global Thin Carrier Tape for Electronic Components Market report?
Answer: Yes, we offer customization options to align with your specific business needs. You can request tailored sections or regional breakdowns.
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Safe checkout with trusted global payment methods.
🌟 Why Choose Infinity Market Research?
At Infinity Market Research, we dont just deliver data — we deliver clarity, confidence, and competitive edge.
In a world driven by insights, we help businesses unlock the infinite potential of informed decisions.
Here why global brands, startups, and decision-makers choose us:
Industry-Centric Expertise
With deep domain knowledge across sectors — from healthcare and technology to manufacturing and consumer goods — our team delivers insights that matter.
Custom Research, Not Cookie-Cutter Reports
Every business is unique, and so are its challenges. Thats why we tailor our research to your specific goals, offering solutions that are actionable, relevant, and reliable.
Data You Can Trust
Our research methodology is rigorous, transparent, and validated at every step. We believe in delivering not just numbers, but numbers that drive real impact.
Client-Centric Approach
Your success is our priority. From first contact to final delivery, our team is responsive, collaborative, and committed to your goals — because you re more than a client; you re a partner.
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