The global TSV Deposition Equipment market size is predicted to grow from US$ 1527 million in 2025 to US$ 2654 million in 2031; it is expected to grow at a CAGR of 9.6% from 2025 to 2031.

TSV technology covers several core process steps: first, the TSV hole is precisely created using deep reactive ion etching (DRIE) technology; then, the dielectric layer is formed using plasma enhanced chemical vapor deposition (PECVD) technology; then, the barrier layer and seed layer are deposited by physical vapor deposition (PVD) technology to prepare for electroplating copper filling; then, the TSV hole is filled by electroplating copper (Cu) process; finally, chemical mechanical polishing (CMP) technology is used to remove excess metal to ensure the flatness of the structure. In addition, for the needs of 3D IC/Si integration, key steps such as wafer thinning and thin crystal bonding are also involved.

TSV deposition equipment is an indispensable key equipment in semiconductor manufacturing. Its core role is to accurately deposit multiple thin film layers in the TSV manufacturing process. These thin film layers include insulating layers, barrier layers, and seed layers.

United States market for TSV Deposition Equipment is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for TSV Deposition Equipment is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for TSV Deposition Equipment is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key TSV Deposition Equipment players cover Applied Materials, Lam Research, TEL, ULVAC, NAURA, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

Infinity Market Research newest research report, the TSV Deposition Equipment Industry Forecast looks at past sales and reviews total world TSV Deposition Equipment sales in 2024, providing a comprehensive analysis by region and market sector of projected TSV Deposition Equipment sales for 2025 through 2031. With TSV Deposition Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world TSV Deposition Equipment industry.

This Insight Report provides a comprehensive analysis of the global TSV Deposition Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on TSV Deposition Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms unique position in an accelerating global TSV Deposition Equipment market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for TSV Deposition Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global TSV Deposition Equipment.

This report presents a comprehensive overview, market shares, and growth opportunities of TSV Deposition Equipment market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:

    PVD
    CVD

Segmentation by Application:

    2.5D Integrated Packaging
    3D Integrated Packaging

This report also splits the market by region:

    Americas
        United States
        Canada
        Mexico
        Brazil
    APAC
        China
        Japan
        Korea
        Southeast Asia
        India
        Australia
    Europe
        Germany
        France
        UK
        Italy
        Russia
    Middle East & Africa
        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the companys coverage, product portfolio, its market penetration.

    Applied Materials
    Lam Research
    TEL
    ULVAC
    NAURA
    Samco Inc
    ACM Research
    SPTS (KLA)
    SPP Technologies

Key Questions Addressed in this Report

What is the 10-year outlook for the global TSV Deposition Equipment market?
What factors are driving TSV Deposition Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do TSV Deposition Equipment market opportunities vary by end market size?
How does TSV Deposition Equipment break out by Type, by Application?