The global UAV Millimeter Wave Radar Packaging Technology market size is predicted to grow from US$ 230 million in 2025 to US$ 413 million in 2031; it is expected to grow at a CAGR of 10.3% from 2025 to 2031.

UAV millimeter wave radar packaging technology refers to the technology of integrating and packaging millimeter wave radar sensors and related components into UAV systems. Millimeter wave radar has become a popular technology in many intelligent application fields in recent years due to its advantages such as small size, easy integration, high spatial resolution, and strong anti-interference ability. As an emerging intelligent device, UAVs have extremely high requirements for sensors. Millimeter wave radar has become one of the important sensors for UAVs due to its unique performance.

United States market for UAV Millimeter Wave Radar Packaging Technology is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for UAV Millimeter Wave Radar Packaging Technology is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for UAV Millimeter Wave Radar Packaging Technology is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key UAV Millimeter Wave Radar Packaging Technology players cover ASE Holdings, Amkor, SPIL, JCET Group, Stats Chippac, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LPI (LP Information)' newest research report, the “UAV Millimeter Wave Radar Packaging Technology Industry Forecast” looks at past sales and reviews total world UAV Millimeter Wave Radar Packaging Technology sales in 2024, providing a comprehensive analysis by region and market sector of projected UAV Millimeter Wave Radar Packaging Technology sales for 2025 through 2031. With UAV Millimeter Wave Radar Packaging Technology sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world UAV Millimeter Wave Radar Packaging Technology industry.

This Insight Report provides a comprehensive analysis of the global UAV Millimeter Wave Radar Packaging Technology landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on UAV Millimeter Wave Radar Packaging Technology portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global UAV Millimeter Wave Radar Packaging Technology market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for UAV Millimeter Wave Radar Packaging Technology and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global UAV Millimeter Wave Radar Packaging Technology.

This report presents a comprehensive overview, market shares, and growth opportunities of UAV Millimeter Wave Radar Packaging Technology market by product type, application, key players and key regions and countries.

Segmentation by Type:

    Flip-chip (FCCSP) Packaging
    Fan-out (eWLB) Packaging

Segmentation by Application:

    Consumer Drones
    Industrial Drones

This report also splits the market by region:

    Americas

        United States
        Canada
        Mexico
        Brazil

    APAC

        China
        Japan
        Korea
        Southeast Asia
        India
        Australia

    Europe

        Germany
        France
        UK
        Italy
        Russia

    Middle East & Africa

        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.

    ASE Holdings
    Amkor
    SPIL
    JCET Group
    Stats Chippac
    J-Devices
    UTAC
    CETC
    Unisem