The global Wafer Back-Grinding Machine market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.

According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.

Infinity Market Research newest research report, the “Wafer Back-Grinding Machine Industry Forecast” looks at past sales and reviews total world Wafer Back-Grinding Machine sales in 2024, providing a comprehensive analysis by region and market sector of projected Wafer Back-Grinding Machine sales for 2025 through 2031. With Wafer Back-Grinding Machine sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Back-Grinding Machine industry.

This Insight Report provides a comprehensive analysis of the global Wafer Back-Grinding Machine landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Back-Grinding Machine portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wafer Back-Grinding Machine market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Back-Grinding Machine and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Back-Grinding Machine.

This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Back-Grinding Machine market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:

    Wafer Edge Grinding Machine
    Wafer Surface Grinding Machine

Segmentation by Application:

    Silicon Wafer
    SiC Wafer
    Sapphire Wafer

This report also splits the market by region:

    Americas
        United States
        Canada
        Mexico
        Brazil

    APAC
        China
        Japan
        Korea
        Southeast Asia
        India
        Australia

    Europe
        Germany
        France
        UK
        Italy
        Russia

    Middle East & Africa
        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.

    Disco
    TOKYO SEIMITSU
    G&N
    Okamoto Semiconductor Equipment Division
    CETC
    Koyo Machinery
    Revasum
    Daitron
    WAIDA MFG
    Hunan Yujing Machine Industrial
    SpeedFam

Key Questions Addressed in this Report

What is the 10-year outlook for the global Wafer Back-Grinding Machine market?
What factors are driving Wafer Back-Grinding Machine market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Wafer Back-Grinding Machine market opportunities vary by end market size?
How does Wafer Back-Grinding Machine break out by Type, by Application?