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Recent Reports
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Global Wafer CMP Machine Market Growth 2025-2031
Sep 2025
Machinery & Equipment
Pages: 138
LPI543
The global Wafer CMP Machine market size is predicted to grow from US$ 3825 million in 2025 to US$ 7522 million in 2031; it is expected to grow at a CAGR of 11.9% from 2025 to 2031.
Chemical Mechanical Polishing is more commonly known as CMP Polishing. This is the process where the top surface of a wafer is polished with a slurry containing an abrasive grit, suspended within reactive chemical agents. The polishing action is partly mechanical and partly chemical. The mechanical element of the process applies downward pressure while the chemical reaction that takes place increases the material removal rate and this is usually tailored to suit the type of material being processed.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
Infinity Market Research newest research report, the “Wafer CMP Machine Industry Forecast” looks at past sales and reviews total world Wafer CMP Machine sales in 2024, providing a comprehensive analysis by region and market sector of projected Wafer CMP Machine sales for 2025 through 2031. With Wafer CMP Machine sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer CMP Machine industry.
This Insight Report provides a comprehensive analysis of the global Wafer CMP Machine landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer CMP Machine portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global Wafer CMP Machine market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer CMP Machine and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer CMP Machine.
This report presents a comprehensive overview, market shares, and growth opportunities of Wafer CMP Machine market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
300MM Polishing Machine
200MM Polishing Machine
Others
Segmentation by Application:
Semiconductor Plants
Research Institutes
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Applied Materials
Ebara Corporation
KC Tech
ACCRETECH
Tianjin Huahaiqingke
Logitech
Revasum
Alpsitec
Key Questions Addressed in this Report
What is the 10-year outlook for the global Wafer CMP Machine market?
What factors are driving Wafer CMP Machine market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Wafer CMP Machine market opportunities vary by end market size?
How does Wafer CMP Machine break out by Type, by Application?
📘 Frequently Asked Questions
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