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Global Wafer Dicing Tape Market Growth 2025-2031
Nov 2025
Semiconductor and Electronics
Pages: 168
LPI36815
The global Wafer Dicing Tape market size is predicted to grow from US$ 497 million in 2025 to US$ 830 million in 2031; it is expected to grow at a CAGR of 8.9% from 2025 to 2031.
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The impact of the latest U.S. tariff measures and the corresponding policy responses from countries worldwide on market competitiveness, regional economic performance, and supply chain configurations will be comprehensively evaluated in this report.
Dicing Tape is a type of adhesive tape used in semiconductor manufacturing, also known as cutting tape.
This report studies the semiconductor wafer dicing tapes, include the UV and Non-UV tapes used in waer dicing processing.
Current the key manufacturers of semiconductor wafer tapes worldwide mainly include Mitsui Chemicals, LINTEC Corporation, Furukawa Electric, Denka, Nitto Denko Corporation, Maxell Sliontec and Sekisui Chemical. In 2023, the top five manufacturers in the world accounted for about 82.5% of the market share. Chinese local manufacturers of wafer tapes are currently mainly in the verification and small batch stages. Representative companies include Shanghai Guke Adhesive Tape Technology, Plusco Tech, Taicang Zhanxin Adhesive Material, Cybrid Technologies, ZZSM, BYE POLYMER MATERIAL, ZHONGSHAN CROWN ADHESIVE PRODUCTS, Yantai Darbond Technology and Sunliky New Material Technology. It is expected that in the next few years, Chinese local companies will gradually grow and occupy a higher share in the Chinese market.
Infinity Market Research newest research report, the Wafer Dicing Tape Industry Forecast looks at past sales and reviews total world Wafer Dicing Tape sales in 2024, providing a comprehensive analysis by region and market sector of projected Wafer Dicing Tape sales for 2025 through 2031. With Wafer Dicing Tape sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Dicing Tape industry.
This Insight Report provides a comprehensive analysis of the global Wafer Dicing Tape landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Dicing Tape portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms unique position in an accelerating global Wafer Dicing Tape market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Dicing Tape and breaks down the forecast by Peel-off Method, by Base Film, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Dicing Tape.
This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Dicing Tape market by product type, application, key manufacturers and key regions and countries.
Segmentation by Peel-off Method:
UV Tape
Non-UV Tape
Segmentation by Base Film:
PO Base Film Tape
PVC Base Film Tape
PET Base Film Tape
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the companys coverage, product portfolio, its market penetration.
Mitsui Chemicals
LINTEC Corporation
Denka
Nitto Denko Corporation
Furukawa Electric
Sekisui Chemical
Maxell Sliontec
Resonac Corporation
Sumitomo Bakelite Company
D&X Co., Ltd
KGK Chemical Corporation
AI Technology, Inc. (AIT)
Ultron System
Daehyun ST
Solar Plus Company
Alliance Material Co., Ltd (AMC)
3M
Shanghai Guke Adhesive Tape Technology
Plusco Tech
Taicang Zhanxin Adhesive Material
Cybrid Technologies
ZZSM
BYE POLYMER MATERIAL
ZHONGSHAN CROWN ADHESIVE PRODUCTS
Yantai Darbond Technology
Sunliky New Material Technology
GTA Material
Key Questions Addressed in this Report
What is the 10-year outlook for the global Wafer Dicing Tape market?
What factors are driving Wafer Dicing Tape market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Wafer Dicing Tape market opportunities vary by end market size?
How does Wafer Dicing Tape break out by Peel-off Method, by Base Film?
Wafer Dicing Tape Market Scope
| Report Attribute | Details |
|---|---|
| Market Size (Start Year) | USD XX Million |
| Market Size (End Year) | USD XX Million |
| Compound Annual Growth Rate (CAGR) | USD XX Million |
| Forecast Period | USD XX Million |
| Base Year | USD XX Million |
| Historical Data | USD XX Million |
| Key Players | USD XX Million |
REPORT COVERAGE
Revenue forecast, Company Analysis, Industry landscape, Growth factors, and Trends
SEGMENT COVERED
By component, deployment, organization size, application, and industry.
REGIONAL SCOPE
North America, Europe, Asia Pacific, Middle East & Africa, South & Central America
COUNTRY SCOPE
Includes key countries across all major regions.
📘 Frequently Asked Questions
1. What is the market size of Global Wafer Dicing Tape Market?
Answer: The global Wafer Dicing Tape market size is predicted to grow from US$ 497 million in 2025 to US$ 830 million in 2031; it is expected to grow at a CAGR of 8.9% from 2025 to 2031.
2. Which regions are analyzed in the Global Wafer Dicing Tape Market report?
Answer: The Global Wafer Dicing Tape Market report covers major regions such as Europe, Middle East & Africa. Each region is analyzed for trends, opportunities, and market dynamics.
3. What methodology is used for forecasting of Global Wafer Dicing Tape Market?
Answer: The Global Wafer Dicing Tape Market report uses a mix of primary research, secondary data, and expert analysis to build its forecasts. Models include both qualitative and quantitative approaches.
4. Are emerging markets analyzed separately in the Global Wafer Dicing Tape Market?
Answer: Yes, the Global Wafer Dicing Tape Market report highlights high-growth emerging regions with dedicated insights. These include untapped opportunities, risks, and potential for expansion.
5. Does the report include competitive benchmarking of Global Wafer Dicing Tape Market?
Answer: Yes, Global Wafer Dicing Tape Market report compares major players based on revenue, product portfolio, innovation, and regional presence. This helps assess competitive positioning.
6. Can I access country-level data within the Global Wafer Dicing Tape Market report?
Answer: Yes, Global Wafer Dicing Tape Market report includes detailed data by country, especially for key markets. This allows for localized insights and decision-making.
7. Can I get customized insights or data from the Global Wafer Dicing Tape Market report?
Answer: Yes, we offer customization options to align with your specific business needs. You can request tailored sections or regional breakdowns.
🔐 Secure Payment Guaranteed
Safe checkout with trusted global payment methods.
🌟 Why Choose Infinity Market Research?
At Infinity Market Research, we dont just deliver data — we deliver clarity, confidence, and competitive edge.
In a world driven by insights, we help businesses unlock the infinite potential of informed decisions.
Here why global brands, startups, and decision-makers choose us:
Industry-Centric Expertise
With deep domain knowledge across sectors — from healthcare and technology to manufacturing and consumer goods — our team delivers insights that matter.
Custom Research, Not Cookie-Cutter Reports
Every business is unique, and so are its challenges. Thats why we tailor our research to your specific goals, offering solutions that are actionable, relevant, and reliable.
Data You Can Trust
Our research methodology is rigorous, transparent, and validated at every step. We believe in delivering not just numbers, but numbers that drive real impact.
Client-Centric Approach
Your success is our priority. From first contact to final delivery, our team is responsive, collaborative, and committed to your goals — because you re more than a client; you re a partner.
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