The global Wafer Thinning and Dicing UV Film market size is predicted to grow from US$ 1047 million in 2025 to US$ 1266 million in 2031; it is expected to grow at a CAGR of 3.2% from 2025 to 2031.

Before the wafer is thinned, a layer of adhesive film will be pasted on the front of the wafer. The function of this layer of film is to fix the chip on the front of the wafer, so that the grinding machine can grind the silicon wafer on the back of the wafer. Generally, the thickness of the silicon wafer before grinding is about 700 ?m. After grinding, the thickness of the wafer becomes 200 ?m, or even reaches the level of 120 ?m. It depends on the customers requirements and the application environment of the chip, that is, the wafer thinning process. Wafer will stick a layer of film on the back of Wafer before slicing. The function of this film is to stick the chip on the film, which can keep the grain intact during the cutting process and reduce the chipping during the cutting process. Ensure that the die will not be displaced and dropped during the normal transfer process, that is, the scribing process in the post-chip packaging and testing process. A film used to fix Wafer and chip is used in chip thinning and dicing process. In the actual production process, this kind of film generally uses UV film

Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.

Infinity Market Research newest research report, the Wafer Thinning and Dicing UV Film Industry Forecast looks at past sales and reviews total world Wafer Thinning and Dicing UV Film sales in 2024, providing a comprehensive analysis by region and market sector of projected Wafer Thinning and Dicing UV Film sales for 2025 through 2031. With Wafer Thinning and Dicing UV Film sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Wafer Thinning and Dicing UV Film industry.

This Insight Report provides a comprehensive analysis of the global Wafer Thinning and Dicing UV Film landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Wafer Thinning and Dicing UV Film portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms unique position in an accelerating global Wafer Thinning and Dicing UV Film market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Wafer Thinning and Dicing UV Film and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Wafer Thinning and Dicing UV Film.

This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Thinning and Dicing UV Film market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:

    Back Grinding UV Film
    Wafer Dicing UV Film

Segmentation by Application:

    IDMs
    OSAT

This report also splits the market by region:

    Americas
        United States
        Canada
        Mexico
        Brazil
    APAC
        China
        Japan
        Korea
        Southeast Asia
        India
        Australia
    Europe
        Germany
        France
        UK
        Italy
        Russia
    Middle East & Africa
        Egypt
        South Africa
        Israel
        Turkey
        GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the companys coverage, product portfolio, its market penetration.

    Mitsui Chemicals Tohcello
    LINTEC
    Denka
    Nitto
    Furukawa Electric
    Sumitomo Bakelite
    D&X
    AI Technology
    ULTRON SYSTEM
    maxell
    NDS
    KGK Chemical
    NEXTECK
    WISE new material
    Vistaic
    Suzhou BoYan Jingjin Photoelectric

Key Questions Addressed in this Report

What is the 10-year outlook for the global Wafer Thinning and Dicing UV Film market?
What factors are driving Wafer Thinning and Dicing UV Film market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Wafer Thinning and Dicing UV Film market opportunities vary by end market size?
How does Wafer Thinning and Dicing UV Film break out by Type, by Application?